|
 early all physical properties of wood are influenced by its moisture content. Written by John F. Siau, this book discusses the interactions between moisture, heat, and wood – the principle source of problems encountered in applications with wood. This book can be used as a text and reference for students and faculty and will also be helpful to engineers, architects, and designers. Chapters include:
- basic wood – moisture relationships;
- elementary wood structure;
- permeability;
- capillarity, osmotic phenomena, and water potential;
- thermal conductivity and electrical properties;
- steady-state moisture diffusion;
- thermodynamics and sorption theories; and
- unsteady-state transport, mass convection, and nonisothermal diffusion.
Also included are laboratory exercises, problems and answers, and an index.
Copyright 1995, 8-1/2 by 11 hardcover, 228 pages, #7282 Original price $59.95, now available for $39.95 for members and $49.95 for nonmembers.
|
